ASML researchers found a way to boost the power of their EUV light source from 600 watts to 1,000 watts. This upgrade should allow them to produce 50% more chips by the end of the decade. They expect the new tech to process 330 wafers an hour compared to the current 220. This helps lower the cost per chip and keeps them ahead of emerging rivals in the US and China. The improvement involves doubling the tin droplets used in the laser process to 100,000 per second.